Qianli QS03 Bumblebee Stencils BGA Reballing Planting Tin Plate For iPhone 7/7 Plus
Qianli QS03 Bumblebee Stencils BGA Reballing Planting Tin Plate For iPhone 7/7 Plus
Spread the cost
No lump sum. No stress. Pick a repayment term that works for your budget — and keep your cash flow intact.
- R79.4/mo 3 months
- R40.15/mo 6 months
- R21.19/mo 12 months
- From R79.4/month over 3 months, or as low as R21.19/month over 12. Total repayable over 12 months: R254.28. Interest at 20.75% p.a. applies.
- Quick online application — most people get a decision within minutes. Your first payment only kicks in 30 days after you buy.
- Mobicred is a registered South African credit provider (NCR reg. NCRCP7852). Available to SA residents aged 18+ with a valid ID and bank account.
At checkout, simply select Mobicred as your payment method.
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Mobicred is a revolving credit facility provided by Retail Capital (Pty) Ltd, a registered credit provider (NCR reg. NCRCP7852) in terms of the National Credit Act 34 of 2005. Credit is subject to approval and an affordability assessment. Interest rate: 20.75% p.a. compounded monthly (1.7292%/month). Available to South African residents aged 18 and older. Full terms & conditions apply.
Duties & Import Tax Information
5-10 business days
In Stock
Processing time: 1-3 business days
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Description
BGA stencils are used for reballing and planting tin on circuit boards. They are essential for rework and reassembly of components like ICs and BGAs.
- Product Type: BGA Stencils
- Brand: QIANLI
- Compatibility: iPhone 7/7 Plus
- Material: High-quality steel
- Key Feature: High temperature resistance
- Design: Square hole design for precise positioning
- Durability: Strong and durable construction for long service life
- Intended Use: Rework and reassembly of ICs and BGAs
- Size: Small and compact
Questions about features, compatibility, or warranty? Chat with our local support team!
