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Kaisi 4pcs Solder Paste Stencil Universal Mobile Phone BGA Reballing Stencils 55 Multi-Purpose Steel Mesh, Model: A482+A467+A508

SKU: TBD0606276401
Sale Sold out Pre-order
Regular price R 289.00
Regular price Sale price R 289.00
Pay in 3, 6, or 12 monthly instalments with

Import Taxes & Duties Included

6-13 business days

In Stock CHN

Processing time: 1-3 days

Description

Kaisi 4pcs Solder Paste Stencil is designed for BGA reballing applications. It provides a solution for computer maintenance engineers to efficiently refill BGA unit chips.

  • Quantity: 4 pieces
  • Function: BGA reballing stencil templates
  • Material: Stainless steel
  • Temperature resistance: High temperature resistant
  • Durability: Wear and tear resistant
  • Application: Suitable for heating and refilling BGA unit chips
  • Success rate: High success rate for solder ball formation
  • Usage: Simple and convenient operation

Questions about features, compatibility, or warranty? Chat with our local support team!