For Xiaomi 15 Ultra Silicone Cooling Hollow Metal MagSafe Phone Case(Silver)
For Xiaomi 15 Ultra Silicone Cooling Hollow Metal MagSafe Phone Case(Silver)
Spread the cost
No lump sum. No stress. Pick a repayment term that works for your budget — and keep your cash flow intact.
- R93.27/mo 3 months
- R47.16/mo 6 months
- R24.89/mo 12 months
- From R93.27/month over 3 months, or as low as R24.89/month over 12. Total repayable over 12 months: R298.68. Interest at 20.75% p.a. applies.
- Quick online application — most people get a decision within minutes. Your first payment only kicks in 30 days after you buy.
- Mobicred is a registered South African credit provider (NCR reg. NCRCP7852). Available to SA residents aged 18+ with a valid ID and bank account.
At checkout, simply select Mobicred as your payment method.
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Mobicred is a revolving credit facility provided by Retail Capital (Pty) Ltd, a registered credit provider (NCR reg. NCRCP7852) in terms of the National Credit Act 34 of 2005. Credit is subject to approval and an affordability assessment. Interest rate: 20.75% p.a. compounded monthly (1.7292%/month). Available to South African residents aged 18 and older. Full terms & conditions apply.
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6-13 business days
In Stock CHN
Processing time: 1-3 days
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Description
The Xiaomi 15 Ultra Silicone Cooling Hollow Metal MagSafe Phone Case is designed to protect the Xiaomi 15 Ultra smartphone. It features a cooling design that helps dissipate heat during prolonged use, making it suitable for everyday activities.
- Product Type: Phone Case
- Compatibility: Xiaomi 15 Ultra
- Material: Metal and Soft Silicone
- Color: Silver
- Key Feature: Cooling Design
- Durability: Wear-resistant and durable
- Protection: Fully protects against scratches, dirt, tears, and wear
- Lens and Screen Protection: Raised edge around screen and camera lens
- Weight: Lightweight and compact
- Ease of Use: Easy to install and remove
- MagSafe Function: Supports wireless charging (only for phones with wireless function)
- Cooling Design: Hollow heat dissipation design for rapid heat dissipation
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