AMAOE For Samsung BGA Reballing Stencil Soldering Repair Tool, Model: SAM20 A156U/A156E
AMAOE For Samsung BGA Reballing Stencil Soldering Repair Tool, Model: SAM20 A156U/A156E
Spread the cost
No lump sum. No stress. Pick a repayment term that works for your budget — and keep your cash flow intact.
- R69.0/mo 3 months
- R34.89/mo 6 months
- R18.41/mo 12 months
- From R69.0/month over 3 months, or as low as R18.41/month over 12. Total repayable over 12 months: R220.92. Interest at 20.75% p.a. applies.
- Quick online application — most people get a decision within minutes. Your first payment only kicks in 30 days after you buy.
- Mobicred is a registered South African credit provider (NCR reg. NCRCP7852). Available to SA residents aged 18+ with a valid ID and bank account.
At checkout, simply select Mobicred as your payment method.
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Mobicred is a revolving credit facility provided by Retail Capital (Pty) Ltd, a registered credit provider (NCR reg. NCRCP7852) in terms of the National Credit Act 34 of 2005. Credit is subject to approval and an affordability assessment. Interest rate: 20.75% p.a. compounded monthly (1.7292%/month). Available to South African residents aged 18 and older. Full terms & conditions apply.
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Description
The AMAOE BGA Reballing Stencil is a soldering repair tool designed for reballing various Samsung CPU models. It is applicable in professional repair settings for devices such as the Samsung S21 and S23 series.
- Model: SAM20
- Compatibility: Samsung A156U, Samsung A156E
- Suitable for MediaTek Dimensity 6100+ MT6835V CPU series
- Primary function: BGA reballing stencil for soldering repairs
- Additional compatible models: Samsung S21, S21+, S21 Ultra, Z Flip 3, Z Fold 3, W22, S22, S22 Plus, S22 Ultra, S901, S906, S908, A14, A54, S23, S23 Ultra, S24, S24 Ultra, S25, S25 Plus
- Other compatible CPU series: Qualcomm Snapdragon 888, Exynos 2100, Exynos 1280, Exynos 2200, Snapdragon 8 Gen 1, Exynos 1330, Snapdragon 8 Gen 2, Snapdragon 8 Gen 3, Snapdragon 8 Ultimate Edition
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