SUNSHINE SS-T12B 13 In 1 Mobile Phone Motherboard Smart Repair Heating Platform Kit Support IP7G-16PM/Android Universal
SUNSHINE SS-T12B 13 In 1 Mobile Phone Motherboard Smart Repair Heating Platform Kit Support IP7G-16PM/Android Universal
Customs & Import Duties Information
Understanding Customs Charges
Some orders include customs duties and taxes, while others require you to pay these charges separately.
Local Warehouse (South Africa)
No customs charges apply.
China Warehouse - Orders Under R2,000
Import duties and taxes are included. You will not be charged anything extra.
China Warehouse - Orders Over R2,000
You are responsible for import duties and taxes. The courier will contact you after shipping and before delivery to collect payment.
Hong Kong Warehouse - All Orders
You are responsible for all customs charges. The courier will contact you after shipping and before delivery to collect payment.
When and How You Pay
If customs charges apply, the courier will contact you after your order has shipped and before delivery to your address.
Payment must be made to the courier before your parcel can be released for final delivery.
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Description
• Brand: SUNSHINE
• Compatibility: IP7G-16PM/Android Universal
• Material: Not specified
• Key feature: Intelligent temperature control
• Color/Variant: Not specified
• Intended use: Mobile phone motherboard repair
• Category: Repair Tools
1. Operating voltage: AC220V/50Hz (AC110V can be customized)
2. Temperature range: 80-250°C
3. Net weight: 13 in 1 about 1000g, 9 in 1 about 915g
4. Size: host about 13.5 x 13 x 2.8cm, heating area about 5.2 x 9.5cm
5. Packing list: 13 in 1: host x 1/module x 12/instruction manual x 1/power cable x 1, 9 in 1: host x 1/module x 8/instruction manual x 1/power cable x 1
Functional features:
1. Large heating area, good compatibility, support a variety of motherboard components desoldering operation, more convenient and fast
2. Modular design, a variety of combinations of modules, base universal module, scalability, easy to expand the new module
3. Intelligent temperature control, customized according to different melting point debugging temperature, with fast heating, long life, temperature uniformity
4. 360-degree rotating snap rail design, suitable for different shapes of the motherboard precision clamping, improve maintenance efficiency
5. Accurate positioning module, set up with positioning columns, can be accurately separated and fit the motherboard, easy to pick up, heat dissipation and non-slip
6. No air gun and no soldering iron, support IP7G-16PM/Android series of various sizes of cell phone motherboard layering/tinning/laminating/desoldering
7. Real machine testing to ensure accuracy, suitable for IP16/16Plus/16Pro/16Pro Max, to meet your maintenance needs
Questions about features, compatibility, or warranty? Chat with our support team!
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